发明名称 COIL DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a coil device which has a small thickness, small size, and sufficient soldering strength and magnetic characteristics. SOLUTION: First and second core members 3 and 5 constituting a core assembly are superposed one upon the other, with their one surfaces facing each other. The insulating substrate 11 of a planar coil plate 1 is combined with the core assembly, and parts of the substrate 11 constitute exposed sections A1 and A2 which are exposed on the core assembly. A coil 13 is provided on at least one surface 68 of the substrate 11, and the end sections of the coil 13 are led to terminal electrodes 17 and 19. The metal chips 7 and 9 of external terminals are positioned in the side sections of the core assembly.</p>
申请公布号 JP2001203108(A) 申请公布日期 2001.07.27
申请号 JP20000009525 申请日期 2000.01.18
申请人 TDK CORP 发明人 KAJINO TAKASHI;NAGASAKA TAKASHI
分类号 H01F5/04;H01F17/00;H01F30/00;(IPC1-7):H01F17/00 主分类号 H01F5/04
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