MULTILAYER WIRING BOARD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board 100 for semiconductor device (for package), with which multi-layers are wired by multiple insulator layers 131-135 and a wiring layer composed of multiple patterned conductive layers. SOLUTION: Concerning the multilayer wiring board for semiconductor device (for package), with which multi-layers are wired by multiple insulator layers 131-135 and the wiring layer composed of multiple patterned conductive layers, a power source pattern (wiring) 127 similar to signal wiring 121 and 122 or ground pattern (wiring) 125 similar to signal wiring is located through the insulator layer while being paired along with signal wiring. Further, the power source pattern (wiring) similar to signal wiring or ground pattern (wiring) similar to signal wiring is located through one insulator layer while facing signal wiring.