发明名称 JUNCTION STRUCTURE OF SANDWICH LAMINATION BOARD
摘要 PROBLEM TO BE SOLVED: To provide the junction structure of a sandwich lamination board that is not deformed or released and is suited for the outer wall, the inner wall, the partition, or the like of a building even if it is thermally affected or an adhesive deteriorates while constantly maintaining the gap between composite boards for composing the sandwich lamination board. SOLUTION: In the junction structure of sandwich lamination boards for joining the end faces of a sandwich lamination board 21, where a heat-insulating material 22 is sandwiched by composite boards 23a and 23b, via a joint 26, the joint 26 is composed of a joint main body part 26 that is provided on the end face of the sandwich lamination board 21 along the longitudinal direction, covers the end face of the heat- insulating material 22, has a nearly L-shaped section and a step part at a front side, and an engagement part 29 that projects from the rear surface side of both the side parts along the longitudinal direction of the joint main body part 27 and is engaged to the recess and projection of the end part of the composite boards 23a and 23b, the high and low positions of a step part 27a of the joint 26 in the adjacent sandwich lamination board 21 are allowed to oppose each other, and the sandwich lamination boards are joined each other by including a fireproof packing 31 between both joints as a packing member.
申请公布号 JP2001200598(A) 申请公布日期 2001.07.27
申请号 JP20000010546 申请日期 2000.01.19
申请人 SAKURA GOMME KK 发明人 NAKAMURA TETSUYA
分类号 E04B1/80;E04B1/684;E04B1/94;E04C2/38;E04F13/08;(IPC1-7):E04B1/684 主分类号 E04B1/80
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