发明名称 FILM THICKNESS CONTROL METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a film thickness control method for completely forming and removing coating with an optimum film thickness that is formed by using vapor obtained by evaporating stock solution. SOLUTION: The average film thickness of coating is measured over a wide range by a feeler-type film thickness measuring instrument or the like, and at the same time the amount of main constituent of coating is analyzed, for example, by a time-of-flight secondary ion mass spectrograph, thus grasping and controlling the accurate amount of main constituent of coating.</p>
申请公布号 JP2001203250(A) 申请公布日期 2001.07.27
申请号 JP20000008964 申请日期 2000.01.18
申请人 FUJI ELECTRIC CO LTD 发明人 WARATANI SHUZO;ISHIWATARI OSAMU
分类号 G01B11/02;G01N23/225;G01N27/62;G03F7/26;H01L21/027;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01B11/02
代理机构 代理人
主权项
地址