| 摘要 |
Electronic casing comprises plate (10) made of aluminum or aluminum alloy, e.g. with small addition of magnesium, constituting a heat sink, with at least one side having trenches (36) and/or cavities (38) for microelectronic components (22). The surface of plate is totally covered with oxide layer carrying a network of printed conducting tracks (16A,16B), wherein at least some cover the trenches. The microelectronic component (22) placed in cavity (38) is in an inverted position so that the side without electrical contacts is at the bottom of cavity; the contacts on upper side are connected by conductors to tracks and fastened by soldering utilizing e.g. tin-lead solder. The casing can also include a protective cover enveloping the microelectronic components and having edges fastened to the edges of plate. The side of plate opposite to that carrying the microelectronic components can have projecting parts to increase the heat dissipation. The plate can have holes for pins traversing the plate for electrical connections, wherein at least one side of the plate and the holes are covered with oxide layer; the pins are connected by soldering to t racks and are projecting on the other side of plate forming a connector. The thickness of plate is e.g. 2-30mm, and a network of tracks as equipotential connections is formed on the oxide layer of thickness preferentially 90-140 micrometer.
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