发明名称 METHOD FOR CONNECTING PRINTED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To connect two printed substrates to each other, while a space therebetween is set as a necessary minimum, without having to use a connector. SOLUTION: Projection parts 14 are formed in at least one of a first printed substrate 11 and a second printed substrate 12, and a spacer 13 is formed between the first printed substrate 11 and the second printed substrate 12. In a space to a certain degree that the projection parts 14 do not come into contact with a mating side, the spacer 13 is pinched between the first printed substrate 11 and the second printed substrate 12 to form a clearance, and a solder 15 is made a reflow, so that the first printed substrate 11 is connected to the second printed substrate 12.
申请公布号 JP2001203433(A) 申请公布日期 2001.07.27
申请号 JP20000008904 申请日期 2000.01.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UCHIDA HIROSHI;KINOSHITA SHINYA;KOSHO KAYOKO;OTSUBO KATSUYUKI;MURABE HIROAKI
分类号 H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/14
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