| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor, capable of sufficiently absorbing external stress by an adhesive for fixing a sensor element and having high detection accuracy by preventing noise. SOLUTION: A semiconductor pressure sensor comprises a sensor element 6, an internal space for containing the sensor element 6 and a package provided at the bottom with a pressure introduction hole 10 connecting with the exterior of the sensor. Since a first projection 11 is placed at the edge of the pressure introduction hole 10, an adhesive storage 12 is formed and the sensor element 6 is arranged on the first projection 11. The sensor element 6 is fixed in the package, in a state such that the adhesive 13 is filled in the adhesive storage 12.
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