| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a shielding case, where solder tends to concentrate on a solder connection part of the shield case, which is mounted on a printing wiring board with a solder. SOLUTION: A recessed part 12 is provided, with allows the heat of solder to tend to concentrate on the solder connection part of a side surface 11a of a shield case 11, mounted on a printed wiring board 10 with a solder.
|
