WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wafer holder capable of preventing heat from diffusing to the backside of a wafer holding surface. SOLUTION: The holder comprises a heater 1 and at least a pair of ceramic bases 4 sandwiching the heater 1, a structure A at the backside behind the heater 1 has a heat insulated structure, the ceramic bases 4 in the backside structure A are ceramics having a lower thermal conductivity than that of the ceramic bases 4 in the holding surface structure B, the ceramic bases 4 contained in the backside structure A have a thermal conductivity of 100 W/mK or less, and adhesive layers 5 have a thermal conductivity of 10 W/mK or less.