| 摘要 |
PROBLEM TO BE SOLVED: To provide the interlayer connection method of a circuit wiring board and the circuit wiring board, which can markedly simplify work required for interlayer connection, can reduce cost, miniaturize land diameter and improve reliability. SOLUTION: Metallic balls 4, which can be deformed by heat press, are arranged on a surface in the interlayer connection schedule part of a first conductor layer 2. The metallic balls 4 are deformed and are embedded in the insulating layer 1, while the interlayer connection schedule part of the first conductor layer 2 is pushed into the insulating layer 1 through the metallic ball 4 by heat press.
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