| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer, where the surface and the back can be easily distinguished with the naked eyes in the case of a semiconductor wafer whose both surfaces, the surface and the back, are subjected to mirror surface polishing. SOLUTION: In a semiconductor wafer, the surface and the back are subjected to mirror-finish polishing, and the outer peripheral surface is subjected to beveling work. Either of the surface side and the back side of the outer peripheral surface is subjected to tapered beveling work (oblique straight line beveling work).
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