| 摘要 |
PROBLEM TO BE SOLVED: To provide a machining method of a chip component, where the influence of heat by laser beam irradiation is small and cleaving speed is high, and to provide its equipment. SOLUTION: Cleaving is performed by moving a substrate 1 in the direction of an arrow 6, while cooling gas is jetted against cooling regions 5-1 and 5-2 of both side surfaces of a region 4 irradiated with a laser beam 22-2 or both side surfaces and a cooling region 5 of the rear district. The region 4 is rapidly turned into a state of high temperature, and both side surfaces of the region 4 or both side surfaces and the rear district are turned into a state of low temperature. As a result, temperature distribution in the direction perpendicular to a cleaving crack line 3 of the substrate 1 becomes markedly sharp, and stress distribution also becomes sharp due to the temperature distribution. Consequently, linearity of the cleaving crack line 3 can be improved, and larger compressing stress is applied, so that cleaving speed can be increased. |
