| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device capable of easily closely contacting a board made of a resin sheet having flexibility and insulation properties with a heat sink. SOLUTION: The power semiconductor device 9 of the shape in which a board 1 and a cover 7 are slightly bulged to a protrusion-like state is obtained y hermetically sealing an opening 4A of a case 4 by a board 1 made of a resin sheet for fixing a power semiconductor chip 3 via a semiconductor pattern 2, internally wiring by using connecting conductors having flexibility, hermetically sealing an opening 4B of the case 4 by the cover 7, and sealing compressed air 8 having a oressure higher than that of the atmosphere in a blocked space S. Thus, when the device 9 is mounted on a heat sink 10, a contact surface is previously coated with a grease (not shown). A center of a protrusion of the board 1 is contacted with the mounting surface 10A, and its contacting area is gradually increased from the center of the protrusion toward a periphery to closely contact the board 1 with the surface 10A. |
