DIAMOND WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technique for realizing multiplayer wiring in diamond having highest heat conductivity among the materials. SOLUTION: A diamond wiring substrate 10 has a diamond substrate 1 and implantation layers 2, 3, 4, where a metallic element exists in the thickness of 10 nm or larger and concentration of 1020 cm-3 or higher in the diamond substrate 1. The implantation layers 2, 3, 4 are formed through ion implantation with high energy of a metallic element of 1 MeV or higher and with a high dose of 1016 cm-2 or higher.