发明名称 Film-forming apparatus and film-forming method
摘要 There may be used a film-forming apparatus having a substrate 4 that is rotatable around the center of one rotating axis 10 in the vertical direction situated in an inner cylinder 12, and a plurality (four in FIG. 2) of target units each comprising the pair of targets 2A, 2B (2B is under 2A serially arranged in the vertical direction inside an outer cylinder 13 opposite the surface 4a of the substrate 4, which are arranged in parallel in the circumferential direction of the inner wall of the outer cylinder 13. By employing a method whereby voltage is applied while alternately reversing the polarity to each of the targets 2A, 2B, it is possible to form a coating on the surface of a substrate by glow discharge sputtering, to accomplish destaticizing while the sputtering can be carried out using a small in-line or bell jar apparatus with small space.
申请公布号 US2001009221(A1) 申请公布日期 2001.07.26
申请号 US20010764520 申请日期 2001.01.18
申请人 ANZAKI TOSHIAKI;MORI KENJI 发明人 ANZAKI TOSHIAKI;MORI KENJI
分类号 C23C14/34;C23C14/35;C23C14/50;C23C14/54;G02B1/10;H01J37/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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