| 摘要 |
<p>A multi-layered polishing pad (30) for modifying a surface of a workpiece, such as a semiconductor wafer. The polishing pad (30) includes a polishing layer (31), at least one sub-pad layer (36) adjacent the polishing layer (31), and an attachment layer (39) interposed between and releasably joining the polishing layer (31) and at least a portion of the at least one sub-pad layer (36). The release layer (35) may be interposed between the polishing layer (31) and the sub-pad (36) or between adjacent layers of the sub-pad. Multiple release layers (35) may be included that are interposed between the polishing layer and layers of the sub-pad, as desired. sired.</p> |
