Verfahren zum Bestücken von elektrischen Bauteilen und Bestückautomat für elektrische Bauteile

摘要

The invention relates to a method for placing electric components and to a pick-and-place robot for electric components. The aim of the invention is to increase as much as possible the throughput rate of printed boards (16) in an SMD pick-and-place robot (10). To this end, several printed boards (16) are combined to a sub-assembly (30) and are provided jointly with the components in a pick-up station (22). By combining several printed boards it is possible to save some of the steps required for insertion into and withdrawal from the pick-up station (22). The sub-assembly (30) is preferably re-divided into its individual printed boards (16) in order to facilitate an as easy a handling as possible of the printed boards (16) in the subsequent process steps.