发明名称 |
Semiconductor devices having different package sizes made by using common parts |
摘要 |
A semiconductor device having a semiconductor element and a plurality of segments formed by dividing a conductive plate. Some of the segments are electrically coupled with electrodes of said semiconductor element and constitute lead pad portions as mounting electrodes of the semiconductor device. Other segments among the plurality of divided segments constitute die pad portions on which the semiconductor element is mounted. The plurality of divided segments and the semiconductor element are sealed and supported together by a resin material portion. The resin material portion fills the space between the divided segments as the lead pad portions. Semiconductor devices having various package sizes can be fabricated by using standardized common parts.
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申请公布号 |
US2001009301(A1) |
申请公布日期 |
2001.07.26 |
申请号 |
US20010767761 |
申请日期 |
2001.01.23 |
申请人 |
NEC CORPORATION |
发明人 |
AZUMA KOSUKE |
分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/60;H01L23/31;H01L23/495;H01L25/04;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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