发明名称 Bottom electrode of capacitor and fabricating method thereof
摘要 A bottom electrode of a capacitor and a method of fabrication is described. Hemispherical grained silicon (HSG) flexures are formed on a storage node to increase the effective area of the capacitor to increase the capacitance. The storage node includes a first region doped with phosphorous and a second undoped region. HSG flexures are formed on the surfaces of both the first and second region. Flexures formed on the first region are smaller in size than the flexures formed on the second region. This prevents adjacent storage nodes from becoming short-circuited with each other. Also, concave portions are formed on the second region between adjacent flexures. This further increases the effective surface area of the capacitor, which further increases the capacitance of the capacitor.
申请公布号 US2001009284(A1) 申请公布日期 2001.07.26
申请号 US20000745533 申请日期 2000.12.26
申请人 YANG SUNG-HAN 发明人 YANG SUNG-HAN
分类号 H01L21/8242;H01L21/02;H01L27/108;(IPC1-7):H01L21/824;H01L29/76;H01L29/94;H01L31/119;H01L21/20 主分类号 H01L21/8242
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