FAILURE ANALYSIS METHOD USING EMISSION MICROSCOPE AND SYSTEM THEREOF AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

A failure analysis method and system thereof, capable of performing a failure analysis on a semiconductor device, in which LSI chips such as system LSIs are arranged, in conjunction with circuit blocks within an LSI chip and based on a luminous image detected by an emission microscope. The method is characterized by comprising: an emission calculating step wherein an arranging condition of luminous points on an LSI chips-arranged semiconductor device is checked based on a luminous image detected by an emission microscope, luminous points are classified into a plurality of luminous types based on the checked arranging condition of luminous points, and the occurrence frequencies of respective classified luminous types are calculated for each LSI chip and for each of circuit blocks of different types in each LSI chip; and an analysis step for performing failure analysis based on the occurrence frequencies for each LSI chip and for each circuit block as calculated in the emission calculating step.