| 摘要 |
<p>Disclosed are methods for manufacturing electromagnetic interference shields for use around access panels and doors in electronic equipment enclosures and elsewhere. The shields may include an electrically nonconductive substrate in combination with an electronically conductive element. In one embodiment, the method may use vapor deposition, plating, or painting techniques for depositing a conductive layer on the substrate surface. In another embodiment the method may use foam-forming to intersperse conductive elements within the substrate. The conductive layer and conductive elements provide effective shielding and grounding functions, and the substrate provides elastic compliancy and resiliency to the shield.</p> |
