| 摘要 |
An interconnect for connecting two printed circuit boards (30, 32) directly together and a method for achieving same. A through hole (70) is formed in a first printed circuit board (30), which is surrounded by a conductive layer (62). A conductive layer (82) is also deposited on a second printed circuit board (32) opposite the through hole (70). The conductive layers (62, 82) allow for the conduction of electrical signals between and about the two printed circuit boards (30, 32). In the preferred embodiment, the conductive layer (62, 82) is copper metalization and the through hole (70) is plated with copper. A solder joint (58) is applied to fill the through hole (70) and establish electrical connection between the conductive layers (62, 82) on the two printed circuit boards (30, 32). Electrical connection is established by applying the solder joint (58) to and between the conductive layers (62, 82) on both boards (30, 32). In an alternative embodiment using a non-plated through hole (70), the interconnect is achieved by either repetitious localized impact, induced vibration or ultrasonic vibration applied to the solder joint (58) after the solder (56) is deposited.
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