发明名称 Laser machining apparatus
摘要 The invention provides a laser machining apparatus which can effectively machine a fine portion. Accordingly, in a laser machining apparatus which irradiates laser beams (11) onto a subject to be machined (37) so as to perform a machining, there are provided an injection locking type ultraviolet rays laser apparatus (1) having an unstable resonator (45, 46), a condenser array (29) having a plurality of condensers (28) arranged one to one in correspondence to an arrangement of machining positions (98) of the subject to be machined (37), and an intensity distribution converting optical part (25) for converting an intensity distribution of the laser beams (11).
申请公布号 US2001009251(A1) 申请公布日期 2001.07.26
申请号 US20010757487 申请日期 2001.01.11
申请人 KOMATSU LTD. 发明人 SEKIZAWA NORIYUKI;NIWATSUKINO YOSHIYUKI;SAJIKI KAZUAKI;TABATA AKI
分类号 B23K26/06;B23K26/067;B23K26/073;B23K26/38;B23K101/42;H01L21/268;H01S3/00;H05K3/00;(IPC1-7):B23K26/06 主分类号 B23K26/06
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