METHOD FOR PRODUCING AN ELECTROMAGNETIC SHIELD

摘要

The invention relates to a method for producing a mechanical and electroconductive connection between a printed circuit board or a housing pa rt and an electroconductive cover (metal cover) in order to provide electromagnetic shielding. The relatively rigid metal covers of the type mentioned here are mechanically fixed by soldering onto a printed circuit board and when the soldering process is successful, also offer good shieldin g. However, the supply of heat required for the soldering process repeatedly creates difficulties for the electrical components or the shielding of the electrical components using the metal cover technique in series production. The aim of the invention is to eliminate the aforementioned difficulties and improve the existing production technology. According to the inventive metho d for producing a connection between a printed circuit board and an electroconductive cover for providing electromagnetic shielding, an electroconductive mass, preferably a flowable mass, which is workable in its starting state, is positioned between the printed conductor board and the cover. The cover is fixed to the printed circuit board by means of the electroconductive mass and at the same time, an electrical bond is produced between the cover and the printed circuit board.