发明名称 |
Pressure sensor with transducer mounted on a metal base |
摘要 |
A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
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申请公布号 |
US2001009195(A1) |
申请公布日期 |
2001.07.26 |
申请号 |
US20010815900 |
申请日期 |
2001.03.22 |
申请人 |
SOLANKI DINESH;BRYZEK JANUSZ |
发明人 |
SOLANKI DINESH;BRYZEK JANUSZ |
分类号 |
G01L9/00;G01L19/14;(IPC1-7):H05K5/06;H01L23/28;H01L23/02 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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