发明名称 Pressure sensor with transducer mounted on a metal base
摘要 A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
申请公布号 US2001009195(A1) 申请公布日期 2001.07.26
申请号 US20010815900 申请日期 2001.03.22
申请人 SOLANKI DINESH;BRYZEK JANUSZ 发明人 SOLANKI DINESH;BRYZEK JANUSZ
分类号 G01L9/00;G01L19/14;(IPC1-7):H05K5/06;H01L23/28;H01L23/02 主分类号 G01L9/00
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