APPARATUS AND METHOD FOR ELECTROPLATING A MATERIAL LAYER ONTO A WAFER

摘要

An apparatus and method for electroplating a material layer onto a wafer is disclosed. The apparatus comprises a wafer support for maintaining a wafer within an electrolyte solution during electroplating. A probe, proximate the wafer support, receives an electrical current and is operable to electrically couple to the wafer. An anode comprising the material is proximate the wafer support. An anode source is electrically coupled to the anode. The anode source induces electrical current between the wafer and the anode by providing a potential difference to the anode such that the anode is positively charged relative to the wafer. A current controller varies the induced electrical current as the material is deposited upon the wafer.