HEAT PIPE TYPE COOLING DEVICE OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A heat pipe type cooling device of a semiconductor device and a method for manufacturing the same is provided to implement the heat sink along with conventional cooling devices in order to maximize cooling effect. CONSTITUTION: The heat pipe type cooling device of the semiconductor device includes one chip body(10). The body includes a center hole(40) to which operational liquid(versatile liquid) is injected. The center hole includes one external surface which touches a semiconductor chip and the other external surface which is coupled with a conventional fan or air cooler. The liquid is applied between the conventional coolers. The internal surface of the body further includes a guiding hole as well as a porous material(30). The guiding hole includes small holes which guides the volatile liquid to move from the center to outside according to a small tube phenomenon. The porous material is implemented on the internal surface of the body adjacent to the semiconductor chip.