发明名称 METHOD OF MANUFACTURING SILICON SUBSTRATE
摘要 PURPOSE: A method of manufacturing a silicon substrate is provided to form an oxide film thinner than the difference in level by high-pressure thermal oxidation on a silicon substrate. CONSTITUTION: The silicon substrate for an optical device is one which is small in warp besides being excellent in electric property, and is roughly constant in concentration of oxygen even in thickness direction and in which the interface between an oxide film and the silicon can be recognized clearly, and this is suitable as a substrate or the like for the optical waveguide path device an optical integrated circuit. According to the manufacture of this silicon substrate, the terrace structure of such a silicon substrate can be manufactured industrially advantageously in a short time in a simple process by suppressing the occurrence of a warp or microcracks.
申请公布号 KR20010070005(A) 申请公布日期 2001.07.25
申请号 KR20000043570 申请日期 2000.07.28
申请人 NTT ELECTRONICS CORPORATION;SHIN-ETSU CHEMICAL CO., LTD. 发明人 EJIMA SEIKI;HORIGUCHI MASAHARU;MAEDA YASUSHI;MAKIKAWA SHINJI
分类号 G02B6/12;G02B6/13;(IPC1-7):H01S5/20 主分类号 G02B6/12
代理机构 代理人
主权项
地址