SEMICONDUCTOR WAFER INSPECTION DEVICE

摘要

PURPOSE: To realize a semiconductor wafer inspection device capable of measuring alignment marks in different focal positions with high accuracy in a short measuring time. CONSTITUTION: In this semiconductor wafer inspection device, an optical image of a surface of a semiconductor wafer 100 is formed. The wafer 100 is made up of a first process layer 12 with a first alignment mark and a second process layer 13 with a second alignment mark. The device is equipped with a confocal optical system 44, 45 having a focal position varying depending on wavelength and used to form the optical image of the surface of the wafer and a light source 41 with a wide range of wavelengths for the optical system.