发明名称 Heat sink structure adapted for use in a computer housing
摘要 A heat sink structure adapted for use in a computer housing includes a thin plate (2) of metal mounted on an inner side of a light plastic computer housing (1). A clearance (3) is confined between the plate (2) and the housing (1). The plate (2) is connected to a main board (5) disposed above it. A heat sink element (7) of a central processing unit (6) on the main board (5) has at least one heat pipe (8) connected to the plate (2) to dissipate heat in the housing (1) via the plate. The housing is further provided with a fan (9) to guide hot air out. The plate (2) may be formed with air vents to enhance air circulation and/or with ribs to enhance heat dissipation. The plate is preferably formed from copper or aluminium that has good heat conductivity. A thin plate may also be provided above the main board for enhanced heat dissipation.
申请公布号 GB2358521(A) 申请公布日期 2001.07.25
申请号 GB20000001569 申请日期 2000.01.24
申请人 YANG-SHIAU * CHEN 发明人 YANG-SHIAU * CHEN;YANG-SHIAU * CHEN
分类号 G06F1/20;H01L23/433;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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