| 摘要 |
PURPOSE: To provide a semiconductor device and production thereof, with which a package can be miniaturized and handling or performance test and the like can be simplified by using no rewiring board while attaining cost reduction. CONSTITUTION: For the production of this semiconductor device, the semiconductor device provided with a semiconductor chip 11 to connect electrodes corresponding to the plural electrodes of a wiring board to the respective electrodes is produced. In this production, plural metal bumps 12 corresponding to the electrode patterns of the semiconductor chip 11 are formed at least on one of the semiconductor chip 11 and a temporary board 13 having a size corresponding to this semiconductor chip 11, the semiconductor chip 11 and the temporary board 13 are mutually fixed via the metal bumps 12, a protective layer 14 is formed by filling the gaps between the semiconductor chip 11 and the temporary board 13 and mutually between the metal bumps 12 with underfill resins and causing these resins to harden, and the temporary board 13 is removed from the protective layer 14 and the metal bumps 12. |
