发明名称 MANUFACTURING METHOD FOR FLEXIBLE PRINTED CIRCUIT BOARD USED FOLDER TYPE PERSONAL COMMUNICATION ASSISTANTS
摘要 PURPOSE: A manufacturing method for flexible printed circuit board(PCB) used folder type personal communication assistants is provided to improve the flexibility and to remove the slope between the folder unit and the main body at the exposure process and to implement the infinitesimal pattern by forming the laminated copper film on the polyimide. CONSTITUTION: The manufacturing method for flexible PCB includes the steps of laminating the copper film(133) with the polyimide film(111) of the main body(bbb) and the folder unit(aaa) without using the glue, and patterning the copper thickness less than 10 micrometer. The main body(bbb) and the folder(aaa) has the same vertical cut end structure. The manufacturing method does not use a glue, which decreases the copper plating thickness on the via hole and weakens the brittleness of the copper thin film caused by the electro plating.
申请公布号 KR20010069694(A) 申请公布日期 2001.07.25
申请号 KR20010023139 申请日期 2001.04.27
申请人 SEMI ELECTRONICS CO., LTD. 发明人 JUNG, BYEONG YUN;LEE, EON SANG;LEE, GI BAEK
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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