| 摘要 |
PURPOSE: A method to embed passive components is provided to embed thick film passive components on an organic layer wherein a flexible metallic substrate has a conductive paste underprint applied thereon. CONSTITUTION: A method of embedding thick film passive components(101) comprises the following steps: applying as an underprint a conductor paste(106) onto a flexible metallic substrate, firing the article found in step A, applying at least one resistor paste onto the underprint, firing the article found in step C, applying the fired paste side of the article found in step D onto at least one side of an organic layer which is at least partially coated with an adhesive layer(104) wherein the fired paste side of the article is embedded into the adhesive layer. |
