发明名称 |
Method and device for soldering components on delicate support |
摘要 |
Device and component soldering process (15) on flexible circuit (17), the components including soldering terminations (1) positioned on strip connection terminations (2) of the flexible circuit covered with soldering paste (3), the device including a laser (4) delivering heat spots calibrated by intensity and duration on the soldering terminations. <IMAGE> |
申请公布号 |
EP1118412(A1) |
申请公布日期 |
2001.07.25 |
申请号 |
EP20000127250 |
申请日期 |
2000.12.15 |
申请人 |
FRAMATOME CONNECTORS INTERNATIONAL |
发明人 |
BOUDOT, CECILE;DUNY, PIERRE-GUY;STRICOT, YVES;FAURE, JEAN-BERNARD;CAPPE, PATRICE |
分类号 |
B23K1/005;H05K1/18;H05K3/34 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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