| 摘要 |
<p>A wafer holder (10) is configured of a pair of ceramic base members (4) and conductive layers (1, 2, 3) each posed between the ceramic base members. The conductive layer (1, 2, 3) has a body (1A, 2A, 3A) facing a wafer (20) and an extraction (1B, 2B, 3B,) extracted from the body for external connection, wherein the body (1A, 2A, 3A) and the extraction (1B, 2B, 3B) are arranged in a single plane. Thus there can be obtained a wafer holder for use with a semiconductor manufacturing apparatus that can reduce such distortion as caused when it is heated and cooled and that can also be readily manufactured.</p> |
