发明名称 LATERAL THIN-FILM SILICON-ON-INSULATOR (SOI) DEVICE HAVING A GATE ELECTRODE AND A FIELD PLATE ELECTRODE
摘要 A lateral thin-film Silicon-On-Insulator (SOI) device includes a semiconductor substrate, a buried insulating layer on the substrate and a lateral transistor device in an SOI layer on the buried insulating layer and having a source region of a first conductivity type formed in a body region of a second conductivity type opposite to that of the first. A lateral drift region of a first conductivity type is provided adjacent the body region, and a drain region of the first conductivity type is provided laterally spaced apart from the body region by the drift region. A gate electrode is provided over a part of the body region in which a channel region is formed during operation and extending over a part of the lateral drift region adjacent the body region, with the gate electrode being at least substantially insulated from the body region and drift region by an insulation region. In order to provide improved breakdown voltage characteristics, a dielectric layer is provided over at least a part of the insulation region and the gate electrode, and a field plate electrode is provided over at least a part of the dielectric layer which is in direct contact with the insulation region, with the field plate electrode being connected to an electrode of the lateral transistor device.
申请公布号 EP1118125(A1) 申请公布日期 2001.07.25
申请号 EP20000943905 申请日期 2000.06.27
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 SIMPSON, MARK;LETAVIC, THEODORE
分类号 H01L21/266;H01L21/336;H01L29/06;H01L29/08;H01L29/40;H01L29/423;H01L29/78;H01L29/786 主分类号 H01L21/266
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