发明名称 |
Substrate processing chambers and methods of operation thereof |
摘要 |
The disclosure relates to a reactor or processing chamber (100) comprising a chamber having a resistive heater disposed within a volume of the chamber, including a stage (185) having a surface area to support a substrate such as a wafer and a body including at least one heating element (180), a shaft (190) coupled to the body, a plurality of temperature sensors (125) coupled to the chamber, each configured to measure a temperature at separate points associated with the surface area of the stage, and a motor (320) coupled to the shaft and configured to rotate the resistive heater about an axis through the shaft. In this manner, the temperature sensors may measure a temperature at separate points of the surface area of the stage. A method of rotating a shaft and measuring a plurality of temperatures over the surface area of the stage or over a wafer seated on the stage with the plurality of temperature sensors.
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申请公布号 |
EP1119024(A2) |
申请公布日期 |
2001.07.25 |
申请号 |
EP20010300409 |
申请日期 |
2001.01.18 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HO, HENRY;RUBINCHIK, ALEXANDER;CHEN, AIHUA (STEVEN);CABREROS, ABRIL;LI, TIANXIAO (STEVEN);YAM, MARK;PEUSE, BRUCE W. |
分类号 |
C23C16/44;C23C16/52;H01L21/00;H01L21/205;H01L21/31;(IPC1-7):H01L21/00 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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