| 发明名称 |
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME |
| 摘要 |
<p>The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin. <IMAGE></p> |
| 申请公布号 |
EP1119227(A1) |
申请公布日期 |
2001.07.25 |
| 申请号 |
EP19990943468 |
申请日期 |
1999.09.28 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
EN, HONCHIN;HAYASHI, MASAYUKI;WANG, DONGDONG;SHIMADA, KENICHI;ASAI, MOTOO;SEKINE, KOJI;NAKAI, TOHRU;ICHIKAWA, SHINICHIRO;TOYODA, YUKIHIKO |
| 分类号 |
C23G1/10;H05K3/00;H05K3/06;H05K3/10;H05K3/38;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
C23G1/10 |
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