发明名称 METHOD OF FORMING TUNGSTEN SILICIDE FILM AND METHOD OF MANUFACTURING GATE ELECTRODE/WIRING
摘要 PURPOSE: To solve a problem that a void V is formed inside an electrode or a wiring of polyside structure in a formation stage in which the electrode and the wiring are formed, and with a reduction in size and resistance of an electrode and a wiring, the adverse effect of the void V gets actualized to deteriorate the manufacture of the electrode and wiring in yield. CONSTITUTION: A tungsten silicide film is formed through such a manner that when a tungsten silicide layer is formed on a polysilicon layer, phosphorus atom-containing gas is added to reactive gas in an initial stage in which the tungsten silicide layer is formed, and the amount of phosphorus atom-containing gas added to the reactive gas is set at 0.2 to 0.45 vol.%.
申请公布号 KR20010070488(A) 申请公布日期 2001.07.25
申请号 KR20010001288 申请日期 2001.01.10
申请人 TOKYO ELECTRON LIMITED 发明人 MATSUDO MASAHIKO;OKUBO KAZUYA;SUZUKI KENJI
分类号 H01L21/28;H01L21/285;H01L21/3205;H01L23/52;H01L29/49;H01L29/78;(IPC1-7):H01L21/28 主分类号 H01L21/28
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