| 摘要 |
<p>The object of the invention is to prevent the adhesion of particles on the surface of wafer even if particles are generated during transport. When wafers after mirror-polishing, cleaning, and drying are transferred into a container body of which the top opening is covered by a top cover and hermetically sealed after housing the wafers, the container body is disposed so that the top opening is in a direction other than an upward direction, with this attitude of the container body dry air is supplied from the top opening to substitute the air in the container body for dry air, then the top opening is faced toward a wafer supply position with the substituted state by the dry air maintained and the wafers are transferred, and lastly the top cover is attached to the container body. All of these steps are performed under highly clean air condition of absolute humidity of 2 ppm or lower. <IMAGE></p> |
