发明名称 Polishing slurry
摘要 <p>The polishing slurry includes polishing particles having a mean particle diameter of less than about 5 mu m. The slurry contains at least about 0.5 total weight percent oxidizer selected from at least one of the group consisting of HNO3, Ni(NO3)2, Al(NO3)3, Mg(NO3)2, Zn(NO3)2 and NH4NO3. A small but effective amount of a co-oxidizer selected from the group consisting of perbromates, perchlorates, periodates, persulfates, permanganates, ferric nitrate, cerium-containing salts, perbenzoic acids, nitrite compounds, perborate compounds, hypochlorite compounds, chlorite compounds and chloride compounds accelerates removal of substrates; and water forms the balance of the aqueous slurry. &lt;IMAGE&gt;</p>
申请公布号 EP1118647(A1) 申请公布日期 2001.07.25
申请号 EP20010101089 申请日期 2001.01.18
申请人 PRAXAIR S.T. TECHNOLOGY, INC. 发明人 LIU, LEI;KWOK, DORIS
分类号 C09G1/02;C23F3/00;(IPC1-7):C09G1/02 主分类号 C09G1/02
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