IMPROVED MICRO-ELECTROMECHANICAL DEVICE

摘要

PURPOSE: An improved micro-electromechanical device is provided to fabricate several substrates and subject to anodic bonding during manufacturing. CONSTITUTION: The device comprises multiple layers in which: the first layer or set of layers arranged is to function as one or more electrodes(1) or conductors; and the second layer is arranged to function as one or more press contracts(2) or wire contacts or wire bond pads. The second layer has different physical properties than the first layer, wherein the first layer or set of layers is relatively hard or tough and the second layer is relatively soft or malleable.