| 摘要 |
PURPOSE: To obtain a chip-size BGA semiconductor device where a first wiring which connects the pad and bump of a chip together and a second wiring formed on a mounting board or an intra-chip wiring hardly interfere with each other after the semiconductor device is mounted on the mounting board. CONSTITUTION: A BGA semiconductor device is equipped with a chip 2, a first polyimide film 4 which covers all the surface of the chip 2 except bonding pads 3, lands 5 mounted with outer connecting balls and formed at prescribed positions on the polyimide film 4, wirings 6 which are formed on the first polyimide film 4 to connect the pads 3 and the lands 5 together, a second polyimide film 7 which covers all the surface of the chip 2 except the lands 5, a first copper film 8 formed on the second polyimide film 7, a coating resin film 9 formed on the first copper film 8, and solder balls 10 bonded on the lands 5. |
