LEAD FRAME, RESIN PACKAGE AND PHOTOELECTRON DEVICE USING THE SAME

摘要

PURPOSE: A lead frame is provided to achieve resin package which is superior in heat dissipating proper ties and arrange at a fine pitch. CONSTITUTION: The lead frame is possessed of a die pad(200), equipped with a thick-walled die pad body(203) and a middle thick-walled die pad peripheral part(201) provided around the die pad body(203), a support lead(110) connected to the die pad(200), and two or more thin-walled first inner leads(101). The lead frame is enhanced in heat-dissipating characteristics by the thick-walled die pad(200), and the leads can be provided at a fine pitch by reducing them in thickness. The lead frame can be manufactured easily in such a manner that a material is rolled in the direction of an arrow(150) into belt-line regions different from each other in thickness, and the lead frame is punched out of the rolled material by a punching process.