发明名称 AIRTIGHT ROTARY COATING SYSTEM THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an airtight rotary coating system thin film forming device capable of improving the uniformity of the film thickness by suppressing the leakage of a gas inside from a tightly contact part of a tightly closed coating section with an upper cap to suppress the abnormality of film thickness. SOLUTION: This thin film forming device has a structure to prevent the flow-in and -out of a gas between the inside and the outside of the tightly closed coating section 14 by providing 1st straightening vanes 10 on the upper cap 12, providing 2nd straightening vanes 20 on the side wall of the tightly closed coating section 14, suppressing the strain of the tightly closed coating section 14 itself caused by the centrifugal force in the high speed rotation and improving the adhesion property of the tightly closed coating section 14 housing a substrate 16 to the upper cap 12 for charging and discharging the substrate 16.
申请公布号 JP2001198512(A) 申请公布日期 2001.07.24
申请号 JP20000006733 申请日期 2000.01.14
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC;TOKYO OHKA KOGYO CO LTD 发明人 WATABE MASAHIRO;MATSUTANI HIROYASU
分类号 B05C11/08;B05C11/02;H01L21/027;(IPC1-7):B05C11/08 主分类号 B05C11/08
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