发明名称 Electroless metal deposition on silyl hydride functional resin
摘要 A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.
申请公布号 US6265086(B1) 申请公布日期 2001.07.24
申请号 US19990328086 申请日期 1999.06.08
申请人 DOW CORNING LIMITED 发明人 HARKNESS BRIAN
分类号 C23C16/00;C23C18/16;(IPC1-7):B32B15/08 主分类号 C23C16/00
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