发明名称 |
Electroless metal deposition on silyl hydride functional resin |
摘要 |
A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.
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申请公布号 |
US6265086(B1) |
申请公布日期 |
2001.07.24 |
申请号 |
US19990328086 |
申请日期 |
1999.06.08 |
申请人 |
DOW CORNING LIMITED |
发明人 |
HARKNESS BRIAN |
分类号 |
C23C16/00;C23C18/16;(IPC1-7):B32B15/08 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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