Wafer sawing/grinding process

摘要

A wafer sawing/grinding process capable of removing cracks and chipping resulted from a wafer sawing operation. A silicon wafer having an active surface and a back surface is provided. A first tape is attached to the back surface of the wafer and then the wafer is sawn along kerfs between neighboring silicon chips. A second tape is attached to the active surface of the silicon wafer before removing the first tape. The back surface of the wafer is then ground until the wafer reaches a desired thickness. A third tape is attached to the ground back surface of the wafer before removing the second tape.