| 摘要 |
A method for mounting semiconductor elements without lowering the reliability of connection due to the residue of flux in the connection of the semiconductor elements to the wiring substrate. A part of the oxide film of a solder bump 3 can previously be broken by previously heating a semiconductor element 1 and a wiring substrate 2 to a predetermined preheating temperature, and pressure-welding the semiconductor element 1 to the wiring substrate 2. Furthermore, since the oxide film covering the surface of the solder bump 3 can be absorbed in the solder bump 3 by rhythmically moving the solder bump in a predetermined direction in the state where the solder bump is melted by heating the solder bump on the semiconductor element and the wiring substrate to a temperature above the melting point of solder, bonding can be performed without using flux. Furthermore, since the surface of the solder bump 3 formed on the semiconductor element 1 and/or the wiring substrate 2 can be prevented from oxidation, or the oxide film can be reduced by the inert gas or reducing gas 7 in the above-described air isolation box 6, the connection between the semiconductor element 1 and the wiring substrate 2 can further be stabilized.
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