| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a resin-sealed semiconductor device in which resin seal is done in high productivity, and an underfill can be formed without generating a void and which can obtain a resin-sealed semiconductor device excellent in reliability. SOLUTION: The method for producing the semiconductor device in which semiconductor chips 10 are mounted on a substrate 2 with a wiring pattern formed, the connection terminals of the chips 10 are connected electrically with the pattern, and the chips 10 are resin-sealed is composed of a process in which divided chip mounting parts 2t, 2t,... for mounting the chips 10 are formed on the substrate 2, a process in which the chip 10 is mounted on each chip mounting part 2t to be connected with the wiring pattern of each chip mounting part 2t by a flip chip, a process in which a sealing resin 4 is supplied with the substrate 12 covered with a mask 6 to cover the chips 10 in vacuum, a process in which the resin 4 is cured with the resin 4 placed under the atmospheric pressure before being cured, and a process in which the substrate 12 is divided into each chip mounting part 2t. |
