| 摘要 |
PROBLEM TO BE SOLVED: To cut out a semiconductor crystal slice wafer precisely from a semiconductor crystal ingot by completely washing out saw dust generated by cutting and completely cooling cutting heat. SOLUTION: A band saw type cutter has a driving device for rotating one of two pulleys 1a, 1b which can stretch endless belt-shaped blade 2 in which a grindstone is fixed on the lower part side and two sets of blade fixing members 13a, 13b installed at a prescribed distance on both front and rear sides in the advance direction of the blade of a semiconductor crystal ingot fixing device installed on the lower side of the middle position of the linear advance part of one side of the blade. Coolant nozzles 11a, 11b ejecting cutting liquid toward the lower side of the blade passing through the periphery the ingot fixing device are fitted to the members 13a, 13b, respectively.
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